Performs any or all of the following functions in the manufacture of electronic semiconductors: load semiconductor material into furnace; saw formed ingots into segments; load individual segment into crystal growing chamber and monitor controls; locate crystal axis in ingot using x-ray equipment and saw ingots into wafers; and clean, polish, and load wafers into series of special purpose furnaces, chemical baths, and equipment used to form circuitry and change conductive properties.
This career is part of the Manufacturing cluster Production pathway.
A person in this career:
- Manipulates valves, switches, and buttons, or keys commands into control panels to start semiconductor processing cycles.
- Maintains processing, production, and inspection information and reports.
- Inspects materials, components, or products for surface defects and measures circuitry, using electronic test equipment, precision measuring instruments, microscope, and standard procedures.
- Cleans semiconductor wafers using cleaning equipment, such as chemical baths, automatic wafer cleaners, or blow-off wands.
- Studies work orders, instructions, formulas, and processing charts to determine specifications and sequence of operations.
- Loads and unloads equipment chambers and transports finished product to storage or to area for further processing.
- Cleans and maintains equipment, including replacing etching and rinsing solutions and cleaning bath containers and work area.
- Places semiconductor wafers in processing containers or equipment holders, using vacuum wand or tweezers.
- Sets, adjusts, and readjusts computerized or mechanical equipment controls to regulate power level, temperature, vacuum, and rotation speed of furnace, according to crystal growing specifications.
- Etches, laps, polishes, or grinds wafers or ingots to form circuitry and change conductive properties, using etching, lapping, polishing, or grinding equipment.